TITLE Formation of Submicron Patterns on Films PRIMARY INVENTORS Tom Russell, Thomas Thurn-Albrecht, Erik Schaffer, Jurgen Mlynek, and Ullrich Steiner DESCRIPTION This invention offers a novel but easily adapted approach to well defined and well organized hollow structures in polymers. Extremely dense submicron lithographic patterns in films have numerous applications in Microelectronics and data storage, medical and research biotechnologies, high-tech materials for insulators and adhesives. More generally, this invention is suitable for applications requiring well-defined submicron features. APPLICATIONS Ultra-high density lithographies on films for Computing: next generation data storage and microelectronics Biotechnology: drug delivery systems and biomaterials Applications also include insulating materials, ultra-thin laminations, filters, adhesives, and other uses requiring well-defined submicron features. ADVANTAGES Novel and easily scaled patterning system makes use of conventional manufacturing processes Simple, fast, reproducible process is inexpensive and adaptable to a wide range of polymers and geometries Exceptionally high patterned densities Environmentally sound PATENT STATUS U.S. Patent 6,391,217 and U.S. Patent 7,014,786 LICENSING STATUS Available for Licensing and research collaboration DOCKET UMA 00-05 NOTES FOR MORE INFORMATION Office of Commercial Ventures and Intellectual Property Phone: 413-545-3606 Fax: 413-545-3632  E-Mail: cvip@research.umass.edu